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AS1106, AS1107
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Notes
Electrical Parameters
VDD to GND
All other pins to GND
-0.3
-0.3
7
7 or
V DD + 0.3
V
V
Current
DIG 0:DIG 7 Sink Current
SEG A:SEG G, SEG DP
500
100
mA
mA
Latch-Up Immunity
±200
mA
All pins except AS1106 pin 14: ±180 mA
Norm: JEDEC 78
Electrostatic Discharge
Digital outputs
All other pins
1000
1000
V
V
Norm: MIL 883 E method 3015
Continuous Power Dissipation (TA = +85°C)
Narrow plastic DIP
Wide SOIC
1066
941
mW
mW
Derate 13.3mW/oC
above +70oC
Derate 11.8mW/oC
above +70oC
Temperature Ranges and Storage Conditions
Storage Temperature Range
-55
+150
oC
Package Body Temperature (Wide SOIC)
+260
oC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity
1
Moisture Sensitive Level
1
5
1
85
%
Non-condensing
Represents a max. floor life time of unlimited
1. only valid for the SOIC 24-pin package
Revision 2.28
3 - 21
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